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Impact of VT and Body-Biasing on Resistive Short Detection in 28nm UTBB FDSOI -- LVT and RVT Configurations

机译:在28nm UTBB FDSOI中,VT和偏置偏置对电阻短路检测的影响-LVT和RVT配置

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In this paper, we analyse the impact of voltage, temperature and body-biasing on the detection of resistive short defects for low-VT (LVT) and regular-VT (RVT) configurations of a 28nm UTBB FDSOI (Ultra-Thin Body & BOX Fully-Depleted Silicon-on-Insulator) technology. We implemented a similar design in each configuration and compared their electrical behaviors with the same resistive short defect. In addition, this work focuses on determining the individual as well as the combined improvements brought by voltage, temperature and body-biasing settings for achieving the maximum coverage of the resistive short defects.
机译:在本文中,我们分析了电压,温度和身体偏置对低VT(LVT)和28nm UTBB FDSOI(超薄体和盒)的常规VT(RVT)配置的电阻短缺的影响完全耗尽的硅式镶嵌物)技术。我们在每种配置中实现了类似的设计,并将其电力行为与相同的电阻短缺进行比较。此外,这项工作侧重于确定个体以及通过电压,温度和身体偏置设置带来的组合改进,以实现电阻短缺的最大覆盖范围。

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