机译:偏置,电源电压和温度对FDSOI技术中电阻短路缺陷检测的影响
Laboratory of Informatics, Robotics and Microelectronics of Montpellier (LIRMM), University of Montpellier /CNRS, Montpellier, France;
Laboratory of Informatics, Robotics and Microelectronics of Montpellier, Montpellier, France;
Laboratory of Informatics, Robotics and Microelectronics of Montpellier, Montpellier, France;
Laboratory of Informatics, Robotics and Microelectronics of Montpellier, Montpellier, France;
Laboratory of Informatics, Robotics and Microelectronics of Montpellier, Montpellier, France;
Silicon-on-insulator; Inverters; Resistance; Circuit faults; Logic gates; Transistors; Resistors;
机译:用于在过程变化存在下进行电阻短缺陷可检测性的分析模型:应用于28nm批量和FDSOI技术的应用
机译:低温低压检测电阻桥缺陷的研究
机译:低电阻率TANX / TA / TANX金属栅极FDSOI-CMOS技术,具有低温处理
机译:在28nm UTBB FDSOI中,VT和偏置偏置对电阻短路检测的影响-LVT和RVT配置
机译:基于阈值电压差架构的CMOS技术的低于1V的电源参考电压。
机译:表面和散装缺陷对CDTE和相关化合物非接触式电阻率测量的影响
机译:针对28nm UTBB FDSOI中的工艺和温度变化的阈值电压补偿