New thermocompression bonding (TCB) equipment with much higher throughput has enabled significantly lower cost per unit for TCB. Concerns over the risk of large capital equipment expenditures have been mitigated through the development of a flexible manufacturing platform supporting multiple assembly processes. New TCB equipment can be adapted to support die placement for Fan-out Wafer Level Packaging (FOWLP) and High Accuracy Flip Chip placement (HAFC). This paper describes state of the art TCB processes for achieving high throughput and the new equipment platforms enabling a flexible manufacturing infrastructure.
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