THERMOCOMPRESSION APPARATUS, THERMOCOMPRESSION METHOD, FLEXIBLE PRINTED CIRCUIT MANUFACTURED BY THE THERMOCOMPRESSION METHOD, AND ELECTRONIC DEVICE ON WHICH THE PRINTED CIRCUIT IS MOUNTED

摘要

The present invention relates to a thermocompression bonding apparatus and method, flexible circuit board manufactured by that method and electronic apparatus equipped with that circuit board; that is to say, the present invention provides a thermocompression bonding apparatus and a method capable of reducing the degree of the formation of an enclosed space between a flexible circuit board (FPC) and an anisotropic conductive film (ACF). A boundary between the exposed portion 3a of the electrode wiring of the FPC1 and an insulating resist layer 4 is located at a position on a backup stage 10 where a recess 14 is formed, and the ACF5 is placed on the upper surface of the FPC1. Thus, a step formed between the insulating resist layer 4 and the exposed portion 3a of the electrode wiring is extremely small. When the ACF5 is heated and pressure-welded by a thermocompression bonding head 11 in this state, the ACF5 can temporarily be fixed on the upper surface of the FPC1 in a state that air is hardly retained on the back side of the ACF5. Thus, when utilizing the ACF5 temporarily fixing on the FPC1 to carry out the formal thermocompression for other substrates can be carried out, obstruction problem toward thermocompression resulting from the air expansion existent in the close space of the ACF5 back side can be avoided.