Study on failure analysis of array chip components in IRFPA

摘要

Infrared focal plane array detector has advantages of strong anti-interference ability and high sensitivity. Its size, weight and power dissipation has been noticeably decreased compared to the conventional infrared imaging system. With the development of the detector manufacture technology and the cost reduction, IRFPA detector has been widely used in the military and commercial fields. Due to the restricting of array chip manufacturing process and material defects, the fault phenomenon such as cracking, bad pixel and abnormal output was showed during the test, which restricts the performance of the infrared detector imaging system, and these effects are gradually intensified with the expanding of the focal plane array size and the shrinking of the pixel size. Based on the analysis of the test results for the infrared detector array chip components, the fault phenomenon was classified. The main cause of the chip component failure is chip cracking, bad pixel and abnormal output. The reason of the failure has been analyzed deeply. According to analyze the mechanism of the failure, a series of measures which contain filtrating materials and optimizing the manufacturing process of array chip components were used to improve the performance of the chip components and the test pass rate, which is used to meet the needs of the detector performance.