首页> 外文会议>SMTA international conference >EVALUATING THE EFFECTS OF PLASMA TREATMENT PRIOR TO CONFORMAL COATING ON ELECTRONIC ASSEMBLIES TO ENHANCE CONFORMITY OF COVERAGE
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EVALUATING THE EFFECTS OF PLASMA TREATMENT PRIOR TO CONFORMAL COATING ON ELECTRONIC ASSEMBLIES TO ENHANCE CONFORMITY OF COVERAGE

机译:评估等离子涂层在电子组件上的等离子体处理对电子组件的影响,以增强覆盖范围的一致性

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The corrosion of Nickel-Palladium-Gold (Ni-Pd-Au) finish terminals in humid environments is known to be reduced with the application of a conformal coating such as acrylic. Corrosion has a higher rate of occurrence around the terminal 'knee' of a surface mount component, which may be reduced with the application of conformal coatings. Although radio frequency (RF) plasma processing is generally known to enhance conformity of conformal coating to surfaces through ionic bombardment, the effect on the functionality of assembled printed circuit boards (PCB) is not as well known. The purpose of this study is to assess whether RF plasma processing can enhance the adhesive and coverage qualities of an acrylic conformal coating on PCBs, specifically on Ni-Pd-Au terminals with a knee, and if plasma processing has an effect on the electrical functionality of components and fully assembled PCB. Optical metrology was used to quantify and photograph the enhanced knee surface after boards were plasma processed and conformally coated with acrylic; electrical testing of printed circuit boards was used to determine electrical functionality. Results show that plasma processing can enhance the quality of the conformal coating as well as increase thickness of the coating around the knee of a terminal. Settings of RF power, process gas, process pressure, and plasma process time were used to come to this result.
机译:众所周知,在湿润的环境中,镍-钯-金(Ni-Pd-Au)精加工端子的腐蚀可通过使用丙烯酸等保形涂层来降低。腐蚀在表面安装组件的端子“拐点”附近发生的可能性更高,可以通过使用保形涂料来减少腐蚀。尽管众所周知,射频(RF)等离子体处理可通过离子轰击增强保形涂层对表面的贴合性,但对组装好的印刷电路板(PCB)的功能的影响尚不为人所知。这项研究的目的是评估RF等离子处理是否可以提高PCB上,尤其是膝盖的Ni-Pd-Au端子上的丙烯酸保形涂层的粘合性和覆盖质量,以及等离子处理是否会对电气功能产生影响组件和完全组装的PCB。在对板进行等离子处理并用丙烯酸共形涂覆后,使用光学计量技术对增强后的膝盖表面进行定量和拍照。使用印刷电路板的电气测试来确定电气功能。结果表明,等离子体处理可以提高保形涂层的质量,并增加端子膝盖周围涂层的厚度。射频功率,工艺气体,工艺压力和等离子工艺时间的设置用于得出此结果。

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