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A Parallel Device Simulator Based on Finite Element Method

机译:基于有限元方法的并行设备仿真器

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摘要

As semiconductor industry advances toward nano-scale technology, it comes across many issues (such as short channel, narrow width, hot-electron effects etc.), which need to be addressed in time to continue advancements with Moore's Law. Technology Computer Aided Design provides a huge scope to build an environment which can be used to design and develop future devices, and study their alterations with much ease. In this paper, a parallel 2D/3D framework is presented to simulate semiconductor devices using finite element method. This method is used to discretize essential device equations and later these equations are analyzed by using a suitable methodology to find solution. OpenMP directives are used to parallelize the solution of device equations on many-core processors. To showcase the effectiveness of the method, a pn junction diode and a MOS capacitor are simulated, and the results are validated with TCAD device simulator Sentaurus.
机译:随着半导体产业向纳米技术的发展,它遇到了许多问题(例如,短沟道,窄宽度,热电子效应等),需要及时解决这些问题,以继续推动摩尔定律的发展。技术计算机辅助设计为构建可用于设计和开发未来设备并轻松研究其更改的环境提供了广阔的空间。在本文中,提出了一个并行的2D / 3D框架,以使用有限元方法来模拟半导体器件。该方法用于离散基本设备方程,随后通过使用合适的方法来分析这些方程以找到解决方案。 OpenMP指令用于在多核处理器上并行化设备方程式的解决方案。为了展示该方法的有效性,对pn结二极管和MOS电容器进行了仿真,并使用TCAD设备模拟器Sentaurus对结果进行了验证。

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