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A Parallel Device Simulator Based on Finite Element Method

机译:基于有限元方法的并联装置模拟器

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摘要

As semiconductor industry advances toward nano-scale technology, it comes across many issues (such as short channel, narrow width, hot-electron effects etc.), which need to be addressed in time to continue advancements with Moore's Law. Technology Computer Aided Design provides a huge scope to build an environment which can be used to design and develop future devices, and study their alterations with much ease. In this paper, a parallel 2D/3D framework is presented to simulate semiconductor devices using finite element method. This method is used to discretize essential device equations and later these equations are analyzed by using a suitable methodology to find solution. OpenMP directives are used to parallelize the solution of device equations on many-core processors. To showcase the effectiveness of the method, a pn junction diode and a MOS capacitor are simulated, and the results are validated with TCAD device simulator Sentaurus.
机译:随着半导体行业对纳米级技术的进步,它遇到了许多问题(如短渠道,窄宽度,热电子效果等),需要及时解决,以继续与Moore Law的进步。科技计算机辅助设计提供了构建环境的巨大范围,可用于设计和开发未来设备,并在轻松的情况下研究其改变。在本文中,提出了一种平行的2D / 3D框架以模拟使用有限元方法模拟半导体器件。该方法用于离散基本设备方程,并通过使用合适的方法来查找解决方案来分析这些方程。 OpenMP指令用于并行化许多核心处理器上的设备方程的解决方案。为了展示方法的有效性,模拟了PN结二极管和MOS电容,并用TCAD设备模拟器Sentaurus验证了结果。

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