首页> 外文会议>IEEE Radio Frequency Integrated Circuits Symposium >Sub-harmonic wireless injection locking of a THz CMOS chip array
【24h】

Sub-harmonic wireless injection locking of a THz CMOS chip array

机译:THz CMOS芯片阵列的次谐波无线注入锁定

获取原文

摘要

A novel concept is introduced for generating high power frequency locked THz radiating based on CMOS chips. The concept is based on an array of CMOS VCO chips with on-chip ring antennas. With fundamental mm-wave oscillation around 115 GHz, the 3 harmonic of 0.35 THz is radiated with record total radiated power (TRP) of -4.3 dBm, EIRP of +3.8 dBm, DC-to-THz efficiency of 1.4% and phase noise better than -95 dBc/Hz at 10 MHz offset. Using a buffer-less Colpitts topology both improves the output power and efficiency but also allows wireless locking of the VCO fundamental frequency using the on-chip antenna, which is an RF-choke for that frequency. This allows wireless coupling between array CMOS chip elements integrated on-board for mutual locking and also wireless locking to an external D-band reference. The concept is demonstrated using a 1×4 array of CMOS radiating chips. The sources can be tuned from 343 to 347 GHz and the injection locking range is around 80 MHz. The 1×4 array has an EIRP of +13.8 dBm, a TRP and DC-to-THz efficiency of +1 dBm and 1.2%, respectively. The 1×4 array locked signal follows the phase noise of the external reference (+9.5 dB) up to a locking range around 80 MHz. This new concept enables simple and cost effective locked CMOS THz scalable source arrays.
机译:提出了一种基于CMOS芯片产生高功率频率锁定THz辐射的新颖概念。该概念基于带有片上环形天线的CMOS VCO芯片阵列。在115 GHz左右的基本毫米波振荡下,辐射出0.35 THz的3个谐波,具有创纪录的-4.3 dBm的总辐射功率(TRP),EIRP为+3.8 dBm,DC-THz效率为1.4%和相位噪声更好在10 MHz偏移时大于-95 dBc / Hz。使用无缓冲的Colpitts拓扑结构不仅可以提高输出功率和效率,还可以使用片上天线(该频率的RF扼流圈)无线锁定VCO基频。这允许在板上集成的阵列CMOS芯片元件之间进行无线耦合,以实现相互锁定,也可以无线锁定至外部D波段基准。使用1×4 CMOS辐射芯片阵列演示了该概念。信号源可以从343 GHz调谐到347 GHz,注入锁定范围约为80 MHz。 1×4阵列的EIRP为+13.8 dBm,TRP和DC-THz效率分别为+1 dBm和1.2%。 1×4阵列锁定信号遵循外部基准的相位噪声(+9.5 dB),直到80 MHz左右的锁定范围。这一新概念可实现简单且经济高效的锁定CMOS THz可扩展源阵列。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号