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Dimensioning for power and performance under 10nm: The limits of FinFETs scaling

机译:10nm以下功率和性能的尺寸确定:FinFET缩放的极限

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In this paper, we review the conditions at which FinFETs could meet system requirements at the 7nm node. The device parasitics appear as most important performance limiters. Following a top-down approach, we find the design space that allows to meet speed and power targets, then explore the optimization of the geometry in combination with disruptive solutions such as air gap spacers and wrapped contacts, the benefits and drawbacks of increased fin height, and a design level solution consisting in fin depopulation. The efficiency of each solution depends on the balance between interconnect and device parasitics.
机译:在本文中,我们回顾了FinFET可以满足7nm节点系统要求的条件。器件寄生效应似乎是最重要的性能限制因素。按照自上而下的方法,我们找到了可以满足速度和功率目标的设计空间,然后结合气隙垫片和包裹式触点等破坏性解决方案,探索了几何形状的优化,以及翅片高度增加的利弊,以及包含散热片数量的设计级解决方案。每个解决方案的效率取决于互连与设备寄生之间的平衡。

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