An empirical study of quality improvement on SiP assembly issue

摘要

This paper provides empirical evidence of fast root cause identification in assembly house for a case in which SiP chip wire bond showed high ratio of quality and reliability escapes. The identification has been performed through FMEA with a large number of RMAs and through quality control to rescreen goods called-back to minimize the field risk by using reliability tests. Furthermore, as a corrective action, authors have been working with major assembly house to implement a set of critical quality gates to improve the quality control in the wire bond process and management.