Prospective new PMC based Gap Waveguide shielding for microwave modules

摘要

In this paper we present a general overview of Gap Waveguide shielding or packaging technique applied in various passive or active microwave modules in order to improve the electrical performance of the respective modules. In this new packaging approach, we use periodic structures to achieve a stop-band by enforcing cutoff condition for all global parallel-plate modes even within an oversized microwave mechanical assembly. Within this stop-band, we are able to suppress all unwanted cavity modes, substrate modes, unwanted EMI and RF feedback, thereby improving the overall system performance. In this work, we recapitulate several realizations of gap waveguide packaging solution, relevant for both high frequency and low frequency microwave applications.