A Substrate-Less Microwave Power-Combining Module Utilizing Ridge Gap Waveguide

摘要

This letter presents the development of a microwave module that does not require a transition substrate to interface with the ridge gap waveguide (RGW). The RGW-to-chip transition is implemented on an all-metal structure using traditional computer numerical control machining and electrodischarge machining. The fabricated module is self-packaged, and the chip carrier assembly allows for quick monolithic microwave integrated circuit substation/exchange in the event of device failure. The designed module operates between 11 and 14.5 GHz, and the simulation and measured results are compared.