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On the degradation kinetics and mechanism of AlGaN/GaN HEMTs under high temperature operation(HTO) stress

机译:高温操作(HTO)应力下AlGaN / GaN HEMT的降解动力学及其机理

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We have submitted the AlGaN/GaN High electron mobility transistors (HEMTs) to the high temperature operation(HTO) temperature step stress experiment to investigate the degradation kinetics at long term HTO stress. Several degradation characteristics of DC parameters such as the reduction of on-state current, the decrease of transconductance, and the shift of threshold voltage were identified. The Photo Emmission Microscopy (PEM) technique was used to characterize the degradation mechanism under HRO stress. The chemical deprocess technique were performed to further analysis the degradation mechanism. The results showed that the degradation was related to the localized structural degradation along the drain-side edge of the fingers.
机译:我们已经将AlGaN / GaN高电子迁移率晶体管(HEMT)提交给高温操作(HTO)温度阶跃应力实验,以研究长期HTO应力下的降解动力学。确定了直流参数的几种劣化特性,例如导通电流的减小,跨导的减小和阈值电压的偏移。使用光发射显微镜(PEM)技术表征HRO应力下的降解机理。进行了化学脱附技术,以进一步分析降解机理。结果表明,降解与沿指状物的漏极侧边缘的局部结构降解有关。

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