III-V semiconductors; MOSFET; gallium arsenide; indium compounds; nanocontacts; nanofabrication; InGaAs; QW-MOSFET; SCE; distance 80 nm; extrinsic engineering; gate-to-gate pitch; high-performance high-density self-aligned MOSFET; intrinsic engineering; metal contact; metal-to-channel resistance; nanoscale contact; precise channel thickness control; resistance property; self-aligned tight-pitch quantum-well MOSFET; short channel effect; size 4 nm; size 40 nm; size 9 nm; specific contact resistivity; voltage 0.5 V; working front-end device structure; Indium gallium arsenide; Logic gates; MOSFET; Metals; Resistance; Semiconductor device modeling;
机译:具有自对准Ni-InGaAs接触金属化的In_(0.7)Ga _(0.3)As沟道n-MOSFET的关态漏电流的减小
机译:具有自对准Ni-InGaAs触点的多栅极Ino.53Gao.47As
机译:通过等离子氮化和ALD $ hbox {Al} _ {2} hbox {O} _ {3} $栅介电和自对准NiGe触头通过快速熔体生长制造的高性能栅极全能GeOI p-MOSFET
机译:In
机译:具有低接触电阻和改进的栅极控制的晶片尺度制造和表征凹槽PTSE2 MOSFET
机译:高性能n型黑磷晶体管可通过厚度和接触金属工程进行类型控制
机译:亚30纳米Inas量子阱mOsFET,具有自对准金属触点和亚1纳米EOT HfO2绝缘体