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A simple and ultra-low power capacitive pressure micro-sensor sensing system design

机译:一种简单而超低的电容式压力微传感器传感系统设计

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The aim of this paper is design and fabrication of a novel fully integrated capacitive pressure sensor that can be detected pressure for airtight structure of industrial and biomedical application. This paper also presents the characterization of the sensing signal processing system with readout sensing circuits. The pressure sensor has 42 sensing cells array, each Cs (sensor capacitance) is connects by 14 parallel sensing cells. The HSPICE is used to evaluate the characteristics of the circuits, and the CoventorWare is utilized to simulate the behaviors of the pressure sensor. The TSMC 0.35μm 2P4M CMOS process is employed for sensor fabrication. The circuit has a pre-simulated initial frequency at 301.5 MHz under no applied force. When under the pressure, the total frequency shift is 179.6 MHz with a corresponding mechanical displacement of 2.64μm and the Cs change to 448.14 fF. The entire chip power dissipation is about 3.2 mW.
机译:本文的目的是设计和制造一种新型完全集成的电容式压力传感器,可以检测到工业和生物医学应用的气密结构的压力。本文还介绍了具有读出传感电路的感测信号处理系统的表征。压力传感器具有42个感测单元阵列,每个CS(传感器电容)由14个平行传感单元连接。 HSPICE用于评估电路的特性,并且利用CoventorWare来模拟压力传感器的行为。 TSMC0.35μm2P4MCMOS工艺用于传感器制造。该电路在无施加力下具有301.5 MHz的预模拟初始频率。在压力下,总频移为179.6MHz,相应的机械位移为2.64μm,CS变为448.14FF。整个芯片功率耗散约为3.2兆瓦。

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