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Study on oxide thickness dependence of current-voltage characteristics for HfO_x based ReRAM device

机译:基于HfO_x的ReRAM器件电流-电压特性的氧化物厚度依赖性研究

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In this letter, we investigated HfO_x thickness dependence of current-voltage characteristics and temperature dependence of resistance for Ni/HfO_x/Pt resistance random access memory (ReRAM) device. There was a significant difference in switching properties between these devices whose oxide thicknesses differ only 1 or 2 nm. The devices showed bipolar resistive switching behaviors. The ON state resistance indicated a linear decrease of resistance with lowering temperature, which was typical for a metal. It should be noted that SET voltage as well as resistance of high resistance state increased almost linearly with increasing oxide thickness from 4.0 to 5.6 nm.
机译:在这封信中,我们研究了Ni / HfO_x / Pt电阻随机存取存储器(ReRAM)器件的电流-电压特性的HfO_x厚度依赖性和电阻的温度依赖性。这些器件之间的开关性能存在明显差异,其氧化物厚度仅相差1或2 nm。该器件表现出双极电阻切换行为。导通状态电阻表示电阻随温度降低呈线性下降,这对于金属而言是典型的。应当注意,随着氧化物厚度从4.0nm增加到5.6nm,SET电压以及高电阻状态的电阻几乎线性增加。

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