Industrial 650V 4-Pack Super-Junction MOSFET Module using Transfer Molding Process

摘要

This paper reports a new design of a 4-pack super-junction MOSFET power module using a transfer molding process. This module initially targets industrial applications, such as photovoltaic (PV) inverters or energy storage system (ESS). Many conventional 650V power modules are gel-filled IGBT modules, but our transfer molded super-junction MOSFET power module can satisfy electrical insulation and thermal conductivity with potential reduction in production cost and module volume. Super-junction MOSFET dies are soldered on a direct bonded copper (DBC) substrate in the power module. Fabrication process is also customized to the molded super-junction MOSFET module. The designed power modules are successfully fabricated, demonstrating a volume reduction. The fabricated modules are evaluated by FEM simulations and experiments, which exhibit excellent thermal and electrical performances. A small thermal resistance (～0.26 K/W) and package on-resistance (～15.7mΩ) are achieved.