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机译:智能电力电子模块的传递模塑技术:材料和工艺
Fraunhofer Institute for Reliability and Microintegration;
Fraunhofer Institute for Reliability and Microintegration;
Fraunhofer Institute for Reliability and Microintegration;
Fraunhofer Institute for Reliability and Microintegration;
Technical University Berlin, Microperipheric Center, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration;
Fraunhofer Institute for Reliability and Microintegration;
Fraunhofer Institute for Reliability and Microintegration;
Fraunhofer Institute for Reliability and Microintegration;
Technical University Berlin, Microperipheric Center, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration;
Fraunhofer Institute for Reliability and Microintegration;
Technical University Berlin, Microperipheric Center, 13355 Berlin, Germany;
harsh environment; high temperature; smart power modules; transfer molding;
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