Guidelines for Transfer Molding Electronic Modules

摘要

Transfer molding techniques were investigated to develop a Guidelines Document applicable to the production of complex electronic modules. This investigation consisted of both a thorough review of the literature and an extensive test program. The overall investigation program included studies in the important areas of stresses in transfer molded modules, design criteria for transfer molded modules, effects of the transfer molding process on components, material and process parameters of transfer molding, and studies on mold design, equipment and layout. The recommendations and guidelines resulting from the program are presented. (Author)