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Growth parameters optimization of GaN high electron mobility transistor structure on silicon carbide substrate

机译:碳化硅衬底上GaN高电子迁移率晶体管结构的生长参数优化

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High electron mobility transistors heterostructures of AlGaN/GaN were grown by metalorganic chemical vapor deposition system on silicon carbide substrate. The growth parameters such as AlN buffer thickness, AlN spacer growth time and Al content in AlGaN barrier layer were optimized. Moreover, the effects of chamber pressure and V/III ratio at the initial growth state of GaN on film crystal quality were also investigated. The optimized AlGaN/GaN heterostructure has AlN buffer thickness of 120 nm, AlN spacer growth time of 10 s and Al content of 28% in the barrier layer. Furthermore, as a result of using higher chamber pressure and lower V/III, both the GaN crystal quality and electron mobility in the AlGaN/GaN were also significantly improved. After the growth parameter optimization, the GaN (002) and (102) planes exhibited X-ray rocking curve widths of 209 arcsec and 273 arcsec, respectively. Besides, the AlGaN/GaN structure also has an electron mobility of 1832 cm/V-s and a sheet electron density of 1.08 ×10 cm, which yielding a sheet resistance of 316 Q/sq.
机译:通过金属有机化学气相沉积系统在碳化硅衬底上生长AlGaN / GaN的高电子迁移率晶体管异质结构。优化了AlN缓冲层厚度,AlN间隔层生长时间和AlGaN势垒层中Al含量等生长参数。此外,还研究了在GaN初始生长状态下腔室压力和V / III比对薄膜晶体质量的影响。优化的AlGaN / GaN异质结构的AlN缓冲层厚度为120 nm,AlN隔离层的生长时间为10 s,势垒层中的Al含量为28%。此外,由于使用较高的腔室压力和较低的V / III,AlGaN / GaN中的GaN晶体质量和电子迁移率也都得到了显着改善。优化生长参数后,GaN(002)和(102)平面分别显示209弧秒和273弧秒的X射线摇摆曲线宽度。此外,AlGaN / GaN结构还具有1832cm / V-s的电子迁移率和1.08×10cm的薄层电子密度,这产生了316Q / sq的薄层电阻。

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