Investigations on the High Temperature Compatibility of Various Adhesion Layers for Platinum

摘要

In this paper we report on the high temperature compatibility of various adhesion layers for platinum (Pt) thin films. We investigated different adhesion layers, such as titanium (Ti), tantalum (Ta), aluminium nitride (AlN), aluminium oxide (Al_2O_3) and titanium oxide (TiO_2). All films were deposited on SiO_2/Si substrate by using the sputter technique. After deposition the films were annealed in air at 800 °C for different time lengths up to 16 hours. After annealing, Al_2O_3 and TiO_2 showed a dense oxide layer between Pt and SiO_2/Si and they seem to be suitable as adhesion layers for Pt at high temperatures. AlN is not suitable as adhesion layer for Pt at high temperatures. Ti and Ta are also not suitable forhigh temperatures, diffusing strongly into Pt layers and leading to the formation of oxide precipitates (TiO_x or TaO_x) in the Pt grain boundaries. In addition, the formation of Pt-crystallites (hillocks) on the surface was common in all the films.