Thermal Spread Design for New Structure IGBT Module Without Base Plate

摘要

With the development of IGBT chips,the power is becoming more and more concentrating.For small and medium power applications,new structure IGBT power module without base plate becomes popular.But for every new thing,there are two sides.The power module without base plate has the advantages of small size,light weight and low cost.But its thermal spread capability is very sensitive to the performance and thickness of thermal grease.The article introduces the influence on power module thermal performance with the different thermal greases at different thicknesses.Finally the pre-applied high performance thermal grease service from Vincotech is introduced.It achieves very good thermal performance improvement with very low cost.