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Atomically Flat Germanium (111) Surface by Hydrogen Annealing

机译:氢退火原子平坦的锗(111)表面

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In germanium (Ge) MOSFET technology, surface planarization is a serious concern for mobility enhancement at high carrier density, reliability improvement of gate dielectrics and morphology control for non-planar FETs. In this work, (111)-oriented Ge substrates were annealed at 350-750°C in pure H_2 atmosphere, and the surface structure and morphology were analyzed with atomic force microscopy. A step and terrace structure was observed on the surface after the H_2 annealing above 500°C. The terrace width is controllable by the off-angle of the initial surface within 0.3° at least. The roughness root mean square (RMS) at 100 × 100 nm on single terrace is ~0.05 nm which is almost our detection limit, which implies that the single terrace on H_2 annealed Ge (111) is atomically flat. Furthermore, even though the initial surface roughness RMS is intentionally increased up to 0.6 nm, atomically flat terrace structure could be obtained by the H_2 annealing.
机译:在锗(GE)MOSFET技术中,表面平面化是对高载流子密度,栅极电介质和非平面FET的形态控制的高载波密度,可靠性改善的严重关注。在这项工作中,在纯H_2大气中在350-750℃下退火GE底物,用原子力显微镜分析表面结构和形态。在500°C以上的H_2退火后,在表面上观察到步骤和露台结构。露台宽度至少可通过初始表面的偏角可控在0.3°内。单个露台100×100nm的粗糙度根均线(rms)是〜0.05 nm,几乎是我们的检测限,这意味着H_2退火GE(111)上的单个露台是原子平的。此外,即使初始表面粗糙度RMS故意增加至0.6nm,也可以通过H_2退火获得原子平坦的露台结构。

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