Physical-Aware System-Level Design for Tiled Hierarchical Chip Multiprocessors

摘要

Tiled hierarchical architectures for Chip Multiprocessors (CMPs) represent a rapid way of building scalable and power-efficient many-core computing systems. At the early stages of the design of a CMP, physical parameters are often ignored and postponed for later design stages. In this work, the importance of physical-aware system-level exploration is investigated, and a strategy for deriving chip floorplans is described. Additionally, wire planning of the on-chip interconnect is performed, as its topology and organization affect the physical layout of the system. Traditional algorithms for floorplanning and wire planning are customized to include physical constraints specific for tiled hierarchical architectures. Over-the-cell routing is used as one of the major area savings strategy. The combination of architectural exploration and physical planning is studied with an example and the impact of the physical aspects on the selection of architectural parameters is evaluated.