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A 13T radiation hardened SRAM bitcell for low-voltage operation

机译:用于低压操作的13T辐射硬化SRAM位单元

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With the increasing demand for ultra-low power memories, and in light of transistor scaling, the Single-Event Upset (SEU) has become a serious problem and therefore an integral aspect of memory cell design [1]. SEUs occur when an energetic particle hits and passes through a semiconductor material, potentially causing a bit-flip in the memory cell [2], [3]. The energetic particle frees electron-hole pairs along its path in the material as it loses energy. When the particle hits a reverse biased pn-junction, such as a transistor diffusion, the injected charge is transported by drift and causes a transient current pulse that can change the node voltage. Data loss occurs when the collected charge exceeds the critical charge (Qcrit) that is stored in the sensitive node. The charge deposited by a particle strike can be calculated from the integral of the transient current pulse, and Qcrit is defined as the minimum charge deposited in a sensitive node that results in memory bit flip. SEUs and other similar Single Event Effects (SEE) are often considered when designing for space applications and similar high radiation environments; however, due to the reduction of Qcrit with technology scaling [4], SEUs can also occur in standard terrestrial environments at non-negligible rates [5]. Architectural solutions, such as error correction (ECC), are often not effective for small arrays in ultra-low power systems operated at low supply voltages, due to their complexity and performance requirements. Technology solutions, such as SOI, can improve the data reliability but do not entirely solve the SEE problems, and often volume manufacturing is not feasible. Therefore, in this work, we propose a radiation hardened low-voltage memory cell for ultra-low power operation. The proposed 13T bitcell is implemented in a standard 0.18μm CMOS process, and is shown to tolerate upsets with charge deposits as high as 500 fC through a dual-driven internal s- lf-correction mechanism.
机译:随着对超低功耗存储器的需求不断增加,并且考虑到晶体管的规模化,单事件翻转(SEU)已成为一个严重的问题,因此成为存储器单元设计不可或缺的一部分[1]。当高能粒子撞击并穿过半导体材料时,会发生SEU,这可能会导致存储单元[2],[3]发生位翻转。高能粒子在失去能量时会沿其在材料中的路径释放电子-空穴对。当粒子碰到反向偏置的pn结(例如晶体管扩散)时,注入的电荷通过漂移传输,并引起瞬态电流脉冲,可以改变节点电压。当收集的电荷超过存储在敏感节点中的临界电荷(Qcrit)时,就会发生数据丢失。可以通过瞬变电流脉冲的积分来计算由粒子撞击所沉积的电荷,并且Qcrit定义为沉积在敏感节点中的最小电荷,这会导致存储位翻转。在为空间应用和类似的高辐射环境设计时,通常会考虑SEU和其他类似的单一事件效应(SEE)。但是,由于随着技术规模的提高Qcrit的减少[4],SEU也可能以不可忽略的速率在标准陆地环境中发生[5]。诸如纠错(ECC)之类的体系结构解决方案由于其复杂性和性能要求,通常不适用于在低电源电压下运行的超低功耗系统中的小型阵列。 SOI之类的技术解决方案可以提高数据可靠性,但不能完全解决SEE问题,因此批量生产通常不可行。因此,在这项工作中,我们提出了一种用于超低功耗操作的辐射硬化低压存储单元。拟议中的13T比特单元采用标准的0.18μmCMOS工艺实现,并通过双驱动内部自校正机制显示了高达500 fC的电荷沉积容忍不安。

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