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Comparative simulation of TriGate and FinFET on SOI: Evaluating a multiple threshold voltage strategy on triple gate devices

机译:TriGate和FinFET在SOI上的比较仿真:评估三栅极器件上的多阈值电压策略

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This study highlights the behavior of triple gate SOI transistors on thin BOx. Simulated in 3D TCAD, TriGate and FinFET structures are evaluated with scaled EOT of 0.82nm, proposed for 10nm technology node. Due to a good compromise of channel control by the gate and back-biasing through ultra-thin BOx, TriGate FETs can combine excellent electrostatics with sufficient body-factor (BF), unlike FinFETs. To be fully efficient, a multi-Vt strategy by back-biasing technique on TriGate needs no BOx recess and ultra-thin BOx of 10nm. In these conditions and at gate length L=15nm, back-biasing on TriGate could allow ×1.3 ION and /16 IOFF performance.
机译:这项研究突出了薄BOx上三栅极SOI晶体管的行为。在3D TCAD中进行仿真,对TriGate和FinFET结构进行了评估,其EOT为0.82nm,建议用于10nm技术节点。由于很好地折衷了通过栅极进行通道控制和通过超薄BOx进行背偏置,因此与FinFET相比,TriGate FET可以将出色的静电与足够的体因子(BF)结合在一起。为了完全有效,在TriGate上采用反向偏置技术的多Vt策略不需要BOx凹陷,也不需要10nm的超薄BOx。在这些条件下,且栅极长度L = 15nm时,TriGate上的反向偏置可提供×1.3 ION和/ 16 IOFF性能。

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