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A novel fixed-outline floorplanner with zero deadspace for hierarchical design

机译:一种新的固定轮廓平面平面图,具有零死空进行层次设计

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Fixed-outline floorplanning, which enables hierarchical design, is considered more and more important nowadays. In this paper, a novel SA-based Fixed-outline Floorplanner with the Optimal Area utilization named SAFFOA is introduced to improve the total wirelength. The basic idea is to build and solve a group of four quadratic equations in four variables iteratively, which can handle the fixed-outline constraint of any aspect ratio. A new topological representation called Ordered Quadtree is then custom-made for this basic idea to facilitate its integration into SA iterations. After the fixed-outline constraint with 100% area utilization is achieved, we will solve the tradeoff between the chip area and wirelength and thus concentrate on the latter in SA process. Experimental results show that the chip wirelength is decreased by about 16.8% and 8.6% on average, compared with two previous fixed-outline floorplanners on soft modules, which are both proved to be better than Parquet. Besides, our method is still competitive on the wirelength, even if compared with some leading-edge outline-free floorplanners. At last, Local Refinement is also adopted to guide the SA process and reshape soft modules to meet the constraint on their aspect ratios (ARs). With its help, SAFFOA can still generate feasible floorplans with no deadspace under a strict AR constraint such as [0.5,2].
机译:固定轮廓平面图,即支持分层设计,被认为是越来越重要的。本文介绍了一种具有名为SaffoA的最佳区域利用率的新型SA的固定轮廓平面平面图,以提高总电线。基本思想是在四个变量中构建和解一组四个二次方程,可以处理任何宽高比的固定轮廓约束。然后,为此基本主意定制了一个名为Quadtree的新拓扑表现,以便于将其集成到SA迭代中。在实现100%面积利用率的固定轮廓限制之后,我们将解决芯片面积和丝格的折衷,从而集中在SA过程中的后者。实验结果表明,与软模块上的两个先前的固定轮廓平面图相比,芯片Wirelength平均减少了约16.8%和8.6%,这两者都被证明比木质镶嵌更好。此外,我们的方法在Wirelength仍然竞争,即使与一些无线的无线平面图相比,也是如此。最后,还采用本地改进来指导SA流程和重塑软模块,以满足其纵横比(ARS)的约束。凭借其帮助,Saffoa仍然可以在严格的AR约束下产生不可行的地板,没有死亡空间,例如[0.5,2]。

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