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The challenge of lead-free electronics for aerospace electronic systems

机译:航空电子系统的无铅电子挑战

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Driven by legislation resulting from two European Union directives, most commercial electronics manufacturers began delivering lead-free electronic components, assemblies, and equipment in 2006. Although not generally affected directly by the legislation, the aerospace industry is being swept along as its electronics supply chain makes the transition which significantly impacts the design, production, and support of aerospace electronic systems. Because of its unique requirements such as long service lifetimes, reparability at the assembly level, rugged operating environments, and high consequences of failure, the aerospace industry must develop its own response to the challenges posed by lead-free electronics. This paper addresses some of these challenges: (1) structures and properties of the most common lead-free alloys; (2) testing and evaluation of lead-free alloys, (3) tin whiskers, and (4) some of the specific aerospace program concerns such as reliability, repair, and product support.
机译:由两个欧洲联盟指令产生的立法驱动,大多数商业电子制造商于2006年开始提供无铅电子元件,组件和设备。虽然通常不会被立法直接影响,但航空航天行业随着电子产品供应链席卷改变过渡,这显着影响了航空航天电子系统的设计,生产和支持。由于其独特的要求,如长的服务寿命,装配水平的可逆性,崎岖的操作环境和失败后果的高度,航空航天行业必须为无铅电子产品提出的挑战制定自己的反应。本文涉及其中一些挑战:(1)最常见的无铅合金的结构和性质; (2)对无铅合金,(3)罐头的测试和评估,(4)一些特定的航空航天计划担忧,如可靠性,维修和产品支持。

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