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A novel sleepy stack 6-T SRAM cell design for reducing leakage power in submicron technologies

机译:一种用于减少亚微米技术泄漏功率的新型困倦堆栈6-T SRAM单元设计

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Static power dissipation is a dominant field in deep sub-micron technologies. Technology scaling down into submicron technology to achieve higher operating speed of CMOS circuits, the leakage power becomes more and more. As process geometrics move to finer technologies, device consistency and threshold voltage becomes much smaller. When decreasing the supply voltage intends to its decreasing the threshold voltage and oxide thickness. Tremendous increasing in device density and reducing threshold voltage result it vigorously increases the leakage power. The main motivation of this article is to reduce leakage power and to maintain the logic state. We propose a new technique by combine of older technique in accordance with leakage power, critical path delay and feasibility issues. The proposed technique simulated in Tanner-SPICE using 180nm, 90nm and 45nm process technology and convincing power reduction is achieved with minimum critical path delay.
机译:静态功耗是深度微米技术的主导领域。技术缩放到亚微米技术以实现更高的CMOS电路操作速度,漏电越来越多。随着过程地理测定方法移动到更精细的技术,设备一致性和阈值电压变小。当降低电源电压时,旨在降低阈值电压和氧化物厚度。设备密度的巨大增加和降低阈值电压结果,它剧烈增加了泄漏功率。本文的主要动机是减少泄漏功率并保持逻辑状态。我们通过根据泄漏功率,关键路径延迟和可行性问题结合旧技术的结合提出了一种新技术。使用180nm,90nm和45nm工艺技术和令人信服的功率降低,实现了在Tanner-Spice中模拟的提出的技术,并且具有最小关键路径延迟。

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