Silicon-package-board co-design for the eye diagram prediction of a 3Gbps HDMI transmitter

摘要

In the design of high-speed transmitter, eye diagram is widely recognized as the most critical specification. For the highspeed data rate higher than 2Gbps, the eye opening would be very sensitive to the system design, such as PCB, connector, package, and so on. To fast converge the inevitable design iteration, a silicon-package-board (SPB) co-design methodology is required for accurate prediction of the output eye diagram. A 3Gbps HDMI transmitter design for display of 4K2K resolution is proposed based on the SPB co-simulation with well-extracted system models. The measured eye diagram at 3Gbps passed the compliance test specification (CTS) and is well correlated to the post-layout simulation result.