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Influence of Mobile Charges in the Substrate of BAW Filters on High Resistivity Silicon

机译:高电阻率硅基底移动电荷对高电阻率硅的影响

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BAW (bulk acoustic wave) filters have emerged as an important technology for GHz filtering components. Especially the high quality factor and the good temperature coefficient make BAW filters well suited for W-CDMA band 2 and band 3 devices. During the design phase it is essential to analyze and minimize possible loss mechanisms to meet the high requirements of these devices. Well known loss mechanisms are metal conductivity, viscosity and acoustic losses. A less well known loss mechanism is the existence of mobile charges at the surface of high resistivity silicon. This loss effect appears between the silicon substrate and the first silicon dioxide layer of the BAW structure. Induced charges increase the insertion loss and influence the performance of BAW filters. The two methods that are most promising for BAW applications to minimize the effect are ion implantation and the use of low charge silicon-dioxide. The aim of this work is the investigation and comparison of the mentioned methods in case of mirror-type BAW filters. We describe the loss mechanism, its counter measures and the impact on the filter performance. Therefore we designed test filters and test structures, manufactured on several test wafers. Additionally we used EM-simulations to evaluate the measurements of our test structures. An extended filter simulation model reflects the measured insertion attenuation of the filter performance pretty well.
机译:BAW(散装声波)滤波器已成为GHz过滤组件的重要技术。特别是高质量因数和良好的温度系数使得非常适合于W-CDMA带2和带3器件的凸起过滤器。在设计阶段期间,必须分析和最小化可能的损耗机制,以满足这些设备的高要求。众所周知的损失机制是金属电导率,粘度和声学损失。较少知名的损失机制是在高电阻率硅表面处存在移动电荷。该损失效应出现在硅衬底和凸曲结构的第一硅层之间。诱导电荷增加插入损耗并影响凸裂过滤器的性能。最重要的两种对BAW应用最小化效果的方法是离子植入和低电荷硅 - 二氧化氧化物的使用。这项工作的目的是在镜型BAW滤波器的情况下提到的方法的调查和比较。我们描述了损失机制,反措施和对滤波器性能的影响。因此,我们设计了在多个测试晶片上制造的测试过滤器和测试结构。此外,我们使用EM-Simulations来评估测试结构的测量。扩展过滤器仿真模型反映了滤波器性能的测量插入衰减。

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