Uniformity improvement and roughness reduction by using non-ion surfactant in the weakly alkaline barrier slurry

摘要

This paper mainly studies the effect of BRIJ30 non-ionic surfactant added to the weakly alkaline slurry which is free of oxidizers and inhibitors on the material removal rate and within wafer non-uniformity (WIWNU) of Cu and TEOS. The experiment results shows that the addition of surfactant into the slurry can improve the uniformity. Meanwhile, as the increase of the concentration of surfactant on the copper slurry, not only the uniformity increases, but also the surface roughness reduces.