Sn-3.0Ag-0.5Cu composite solder reinforced by multilayer graphene

摘要

A Sn-3.0Ag-0.5Cu (SAC) composite solder was fabricated by adding 0.1% weight percentage of multilayer graphene. The process steps are detailedly introduced in this paper. The physical, thermomechanical, wetting, mechanical properties were tested. Experimental results present that density and coefficient of thermal expansion of plain solder are higher than those of composite solder, while the thermal diffusion coefficient and wettability are improved after adding graphene. Besides, as expected, the addition of graphene has slight influence on melting temperature of SAC solder. Furthermore, the shear strength of solder ball joints was also improved more than 40% by adding graphene.