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III-N heterostructure devices for low-power logic

机译:用于低功耗逻辑的III-N异质结构

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Future generations of ultra-scaled logic may require alternative device technologies to transcend the limitations of Si CMOS; in particular, power dissipation constraints in aggressively-scaled, highly-integrated systems make device concepts capable of achieving switching slopes (SS) steeper than 60 mV/decade especially attractive. Tunneling field effect transistors (TFETs) are one such device technology alternative. While a great deal of research into TFETs based on Si, Ge, and narrow band gap III-Vs has been reported, these approaches each face significant challenges. An alternative approach based on the use of III-N wide band gap semiconductors in conjunction with polarization engineering offers potential advantages in terms of drain current density and switching slope. In this talk, the prospects for III-N based TFETs for logic will be discussed, including both simulation projections as well as experimental progress.
机译:未来几代超缩放逻辑可能需要替代设备技术来超越SI CMOS的局限性;特别地,在积极缩放的高度集成系统中的功率耗散约束使得能够实现比60 mV /十年更陡峭的切换斜坡(SS)陡峭的设备概念。隧道场效应晶体管(TFET)是一种这样的设备技术替代方案。虽然报道了基于Si,Ge和窄带隙III-Vs的TFET的大量研究,但这些方法各面临重大挑战。基于使用III-N宽带间隙半导体结合偏振工程的替代方法提供了漏极电流密度和切换斜率的潜在优势。在这次谈判中,将讨论基于III-N基于TFET的前景,包括模拟预测以及实验进展。

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