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Metal layer OPC repair flow for 28NM node and beyond

机译:金属层OPC修复28nm节点及超频的修复流

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At node 28nm and beyond, metal layer have the smallest pitch and the most flexible in design of the critical layer. Various layout patterns on metal layers are challenging to runtime, OPC tools and OPC engineers. The OPC verification played as the role of highlighting fail patterns, and feeding back to the OPC Engineer for further learning and enhancing in the OPC recipe. In this paper the authors presented metal layer OPC repair flow for 28nm node and beyond. An automatic analysis methodology for the pinching, the bridging and the coverage errors were discussed. Next, according to the automated analysis of the error, the OPC repair flow is applied on all locations. This helped in cutting down the total runtime and reached the status of zero errors. This paper also compared the OPC verify result and total runtime of without OPC repair flow and using OPC repair flow. After using OPC repair flow, the OPC verify results are acceptable, and total runtime is reduced greatly.
机译:在节点28nm及更大的情况下,金属层具有最小的俯仰和临界层的设计中最柔韧。金属层上的各种布局模式是对运行时,OPC工具和OPC工程师的挑战。 OPC验证作为突出显示失败模式的作用,并送回OPC工程师以进一步学习和增强OPC配方。在本文中,作者提出了金属层OPC修复流动,用于28nm节点和超越。讨论了捏合,桥接和覆盖误差的自动分析方法。接下来,根据误差的自动分析,OPC修复流量适用于所有位置。这有助于减少总运行时并达到零误差的状态。本文还比较了OPC验证结果和完全运行时间而无需OPC修复流程,并使用OPC修复流程。使用OPC修复流后,OPC验证结果是可接受的,并且总运行时大大减少。

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