Magnetic Field Strength as a Variable in Optimizing Magnetron Sputtering Processes

摘要

As manufacturers seek to optimize their thin film deposition systems for greater throughputand lower operating cost, they most frequently do this through models including cathode poweror current, gas pressure and mixture, and throw distance. In this work the magnetic fieldstrength is examined as an important variable. Data is presented showing how the magneticfield influences the cathode I-V relationship, deposition rate, and heat flux to the substrate withobvious implications on throughput and film quality.