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Heterojunction TFET Scaling and resonant-TFET for steep subthreshold slope at sub-9nm gate-length

机译:Sub-9nm栅极长度陡峭亚阈值缩放和谐振TFET的异质结TFET缩放和谐振 - TFET

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The Tunneling Field Effect Transistor (TFET) is of interest for future low-power technologies due to its steep subthreshold-slope (SS) [1, 2]. In addition to understanding TFET's prospects for future technology nodes [3], we also need to assess if it enables continued scaling required for increasing transistor density. GaSb/InAs heterojunction TFET (Het-j TFET) is one of the leading TFET options due to its high drive-current [4]. In this paper, double-gate (DG) and nanowire (NW) Het-j TFETs (Fig. 1) are atomisticly modeled and compared to a MOSFET down to Lg~9nm, i.e. ITRS 2022 node [5]. To achieve TFET characteristics superior to a MOSFET, its DG body has to be extremely thin, so a NW TFET is therefore preferred due to its more relaxed thickness and better transistor characteristics. A new device - the Resonant-TFET (R-TFET), is proposed, with SS~25mV/dec over ~3.5 decades of current, enabling the scaling of tunneling transistors to sub-9nm gate-lengths (Lg).
机译:由于其陡峭的亚阈值斜率(SS)[1,2],隧道场效应晶体管(TFET)对未来的低功率技术感兴趣。除了了解TFET的未来技术节点的前景[3]之外,我们还需要评估它是否能够增加晶体管密度所需的持续缩放。 Gasb / Inas异质结TFET(HET-J TFET)是由于其高驱动电流的领先TFET选项之一[4]。在本文中,双栅极(DG)和纳米线(NW)HET-J TFET(图1)是原子建模的,并与MOSFET减小到LG〜9nm的MOSFET进行比较,即ITRS 2022节点[5]。为了实现优于MOSFET的TFET特性,其DG主体必须极薄,因此由于其更宽的厚度和更好的晶体管特性,因此优选NW TFET。一个新的设备 - 提出了谐振-TFET(R-TFET),SS〜25mV / DEC超过〜3.5数十年电流,使隧道晶体管的缩放到子9nm门长(LG)。

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