Junction Profile Engineering with a Novel Multiple Laser Spike Annealing Scheme for 45-nm Node High Performance and Low Leakage CMOS Technology

摘要

We developed novel junction profile engineering that uses a newly developed multiple laser spike annealing scheme and applied it to 45-nm node high performance and low leakage CMOS technology. This novel junction profile engineering is effective for the performance improvement of CMOS devices with embedded SiGe in the PMOS regions. Reduction of the source-drain parasitic resistance and the junction leakage current were achieved, thus improving the I{sub}(on) of 33-nm CMOS devices (8.2%/12.8% with an I{sub}(off) = 9 [nA/μm] for PMOS/NMOS). We also demonstrate that the fluorine co-implant plays a large role in reducing the PMOS source-drain extension (SDE) resistance.