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Novel 5V-EDMOS transistor with a record /max of 450 GHz in a baseline 40nm CMOS technology

机译:新颖的5V-EDMOS晶体管,在基线40nm CMOS技术中具有记录/最大450 GHz

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A novel EDMOS device with a breakdown voltage of ~10V and a record high RF performance, with fT ~ 90 GHz and /MAX ~ 450 GHz, is presented. The transistor is composed of a thin gate oxide (logic) in the channel and a thicker oxide (IO) in the drain extension. A separate dummy gate is formed on the extension region to optimize the electric field for minimizing the device degradation due to the hot carrier injection. The device concept has been intensively investigated by TCAD, and fabricated in a baseline 40nm CMOS foundry process without any additional masks. This paper discusses in detail the measured characteristics of the device, including DC, RF and the reliability. For the same operating and breakdown voltage, this device outperforms optimized Si-LDMOS and SiGe HBTs in both fT and fMax, and is on par with the best-in-class GaN-HEMTs in term of fMax.
机译:具有〜10V的击穿电压的新型EDMOS器件和记录高RF性能,具有F T 〜90 GHz和/ MAX〜450 GHz。晶体管由通道中的薄栅极氧化物(逻辑)和漏极延伸的较厚的氧化物(IO)组成。在延伸区域上形成单独的虚设栅极,以优化电场以使由于热载体喷射引起的装置劣化。该设备概念已经被TCAD强烈调查,并在基线40nm CMOS铸造工艺中制造而没有任何额外的面具。本文详细讨论了设备的测量特性,包括DC,RF和可靠性。对于相同的操作和击穿电压,该设备在F t 和f max 中优于优化的Si-LDMOS和SiGe HBT,并与最佳in - F max 期间的agan-hemts。

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