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首页> 外文期刊>IEEE Transactions on Electron Devices >A 243-GHz F{sub}t and 208-GHz F{sub}(max), 90-nm SOI CMOS SoC Technology With Low-Power mm Wave Digital and RF Circuit Capability
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A 243-GHz F{sub}t and 208-GHz F{sub}(max), 90-nm SOI CMOS SoC Technology With Low-Power mm Wave Digital and RF Circuit Capability

机译:具有低功耗毫米波数字和RF电路功能的243 GHz F {sub} t和208 GHz F {sub}(max),90 nm SOI CMOS SoC技术

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摘要

A 90-nm silicon-on-insulator (SOI) CMOS system on-chip integrates high-performance FETs with 243-GHz F{sub}t, 208-GHz F{sub}(max), 1.45-mS/μm gm, and sub 1.1-dB NFmin up to 26 GHz. Inductor Q of 20, VNCAP of 1.8-fF/μm{sup}2, varactor with a tuning range as high as 25:1, and a low-loss microstrip. Transmission lines were successfully integrated without extra masks and processing steps. SOI and its low parasitic junction capacitance enables this high level of performance and will expand the use of CMOS for millimeter-wave applications.
机译:90纳米绝缘体上硅(SOI)CMOS系统片上集成了高性能FET,其243-GHz F {sub} t,208-GHz F {sub}(max),1.45-mS /μmgm,高达26 GHz的低于1.1dB的NFmin。电感Q为20,VNCAP为1.8fF /μm{sup} 2,变容二极管具有高达25:1的调谐范围,并且具有低损耗微带线。传输线已成功集成,无需额外的掩膜和处理步骤。 SOI及其低寄生结电容可实现这一高水平的性能,并将扩大CMOS在毫米波应用中的使用。

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