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A single-crystal silicon 3-axis CMOS-MEMS accelerometer

机译:单晶硅3轴CMOS-MEMS加速度计

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The paper presents a single-crystal silicon (SCS)-based, integrated 3-axis accelerometer fabricated using a post-CMOS micromachining process. This new CMOS-MEMS process provides monolithic integration of electronics and SCS microstructures, and electrical isolation of silicon. By employing a unique vertical sensing mechanism, 3-axis acceleration sensing is achieved with a single proof mass. The symmetric structures and fully differential configuration of all the sensing electrodes can greatly reduce the cross coupling among the 3 axes. By sacrificing one interconnect metal layer, the silicon undercut of the sensing comb fingers is minimized, resulting in much higher sensitivity with the same device footprint. A wet Al etching process was also developed to remove the top Al layer without attacking the Al layers exposed from the sidewalls of the multilayer Al/oxide stacks. A two-stage, open-loop, continuous time chopper stabilized amplifier is integrated on the chip.
机译:本文介绍了基于单晶硅(SCS),集成的3轴加速度计,采用CMOS微机械加工制造。这种新的CMOS-MEMS过程提供了电子设备和SCS微结构的单片集成,以及硅的电气隔离。通过采用独特的垂直感测机构,通过单个验证质量实现3轴加速度感测。所有传感电极的对称结构和完全差分配置可以大大减小3轴之间的交叉耦合。通过牺牲一个互连金属层,感测梳状指的硅底切最小化,导致与相同的装置足迹产生更高的灵敏度。还开发了湿式蚀刻工艺以除去顶部Al层而不攻击从多层Al /氧化物堆叠的侧壁暴露的Al层。两级开环,连续时间斩波器稳定放大器集成在芯片上。

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