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Strain Relaxation and Material Quality Improvement of Compressively Strained GeSn Epitaxial Films through a Cyclic Rapid Thermal Annealing Process

机译:通过循环快速热退火工艺进行压缩应变Gesn外延膜的应变松弛和材料质量改进

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摘要

GeSn films were annealed in cycles of 30 s at 450 and 500 C. The annealing temperature and number of cycles for material quality enhancement and relaxation depends upon Sn mole fraction and film thickness.
机译:GESN薄膜在450和500℃下以30秒的循环退火。材料质量增强和弛豫的退火温度和循环次数取决于Sn摩尔分数和膜厚度。

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