首页> 外文会议>International Conference in Electrics, Communication and Automatic Control;ECAC2011 >Design and Implementation of a Novel Boundary-Scan Circuit in FPGA's Chip
【24h】

Design and Implementation of a Novel Boundary-Scan Circuit in FPGA's Chip

机译:FPGA芯片中新型边界扫描电路的设计与实现

获取原文
获取外文期刊封面目录资料

摘要

This chapter presents a novel Boundary-Scan circuit compatible with IEEE 1149.1 standard in a field-programmable gate array (FPGA). The novel Boundary-Scan circuit not only facilitates the chip test as well as an assembled printed circuit board (PCB) test but also severs as the configuration and verification of FPGA. This circuit is designed based on the configurable feature of FPGA. In this design, the boundary-scan chain can be configured to any desired length, which can efficiently improve the effective test speed. Also, a configurable scan chain controlled by the novel Boundary-Scan circuit can be flexibly formed in the FPGA core from which the controllability and observability of internal signals in the FPGA core are largely enhanced but not increase the overhead design. Besides, the conventional INTEST of Joint Test Action Group (JTAG) can be extended from single-step logic to multiple-step logic by connecting JTAG test elk input (TCK) signal into the test logic of FPGA core. The novel Boundary-Scan circuit has been implemented in an static random access memory (SRAM)-based FPGA fabricated by a 0.5 |im silicon on insulator (SOI) complementary metal oxide semiconductor (CMOS) process. The test results from the fabricated chip indicate that this circuit successfully realizes the desired functions in programming, verification, and testing.
机译:本章介绍了一种在现场可编程门阵列(FPGA)中与IEEE 1149.1标准兼容的新型边界扫描电路。新颖的边界扫描电路不仅有助于芯片测试以及组装的印刷电路板(PCB)测试,而且还可以作为FPGA的配置和验证。该电路是基于FPGA的可配置功能设计的。在这种设计中,边界扫描链可以配置为任何所需的长度,从而可以有效地提高有效测试速度。而且,可以在FPGA内核中灵活地形成由新型边界扫描电路控制的可配置扫描链,由此可以大大增强FPGA内核中内部信号的可控制性和可观察性,但不会增加开销设计。此外,通过将JTAG测试麋输入(TCK)信号连接到FPGA内核的测试逻辑,可以将常规的联合测试行动小组(INTEST)的INTEST从单步逻辑扩展到多步逻辑。新型边界扫描电路已在基于静态随机存取存储器(SRAM)的FPGA中实现,该FPGA由0.5μm绝缘体上硅(SOI)互补金属氧化物半导体(CMOS)工艺制成。所制造的芯片的测试结果表明,该电路成功地实现了编程,验证和测试中所需的功能。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号