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Printability of Native Blank Defects and Programmed Defects and Their Stack Structures

机译:原始空白缺陷和程序化缺陷及其堆栈结构的可打印性

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We describe the characterization of native phase defects in the manufacturing of extreme ultraviolet (EUV) mask blanks using the state-of-the-art mask metrology equipment in SEMATECH's Mask Blank Development Center (MBDC). We used commercially available quartz substrates and deposited Mo/Si multilayers on the substrates to characterize phase defects. We also prepared programmed defects of various dimensions using e-beam patterning technology on which multilayers were deposited. Transmission electron microscopy (TEM) was used to study multilayer profile changes, while SEMATECH's actinic inspection tool (AIT) was used to image defects and predict their printability. Defect images at different focal depths of the AIT are correlated to TEM cross sections and atomic force microscopy (AFM) dimensions. The printability of native and programmed defects was also investigated.
机译:我们使用SEMATECH的掩模坯料开发中心(MBDC)中的最先进的掩模计量设备,描述了在制造极紫外(EUV)掩模坯料中本征相缺陷的特征。我们使用了可商购的石英基板,并在基板上沉积了Mo / Si多层膜以表征相缺陷。我们还使用电子束构图技术在其上沉积了多层,准备了各种尺寸的程序化缺陷。透射电子显微镜(TEM)用于研究多层轮廓的变化,而SEMATECH的光化检查工具(AIT)用于对缺陷成像并预测其可印刷性。 AIT的不同焦深处的缺陷图像与TEM横截面和原子力显微镜(AFM)尺寸相关。还研究了固有缺陷和程序缺陷的可打印性。

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