Self-alignment of silicon chips on wafers: the effect of spreading and wetting

摘要

3D integration is the key to advanced microelectronic systems. Die-to-wafer assembly is a necessary step to reach full integration. Self-assembly methods are promising due to their parallel aspect which overcomes the main difficulties of the current techniques. The aim of this work is the understanding of the mechanisms of self-alignment. In a preceding work, the stable and unstable modes have been investigated, assuming that the fluid completely wets the surfaces of the chip and the fixed pad. In this work, we focus on the mechanism of spreading and the motion of the chip during the spreading. We use again the Surface Evolver software to analyze the mechanisms of the chip motion.