Copper ECMP in phosphoric acid-BTA slurries

摘要

Copper ECMP bench test was conducted for copper in 30 wt% H3PO4+0.01M BTA slurry on a three-electrode tribo-electrochemical system. Electrochemical and tribological performance of copper in the slurry are studied. The inhibition effect of BTA is shown by material removal rate (MRR) and after-ECMP topographies of copper at different anodic potentials are analyzed by AFM. Results show that the applied anodic potential should be low enough to prevent corrosive pitting.