Developer-soluble bottom anti-reflective coatings (DBARCs) were originally designed for use in implant lithography processes. Throughout the development cycle, two main DBARC platforms emerged, nonphotosensitive DBARC (non-PS DBARC) and photosensitive DBARC (PS DBARC). While both platforms have been able to achieve acceptable performance for implant processes, each has advantages and disadvantages. The characteristics of each system are used to recommend a platform for use in various implant processes. DBARC processes are now being compared to single-layer resist and dry BARC processes due to additional applications such as wet-etch layers for high-k dielectric metal gate (HKMG). Integrating a new technology into production is complicated. Therefore, for each of these new applications, the different DBARC platforms have been reviewed to compare performance. The analysis allows us to recommend a DBARC and a favorable process for each application, thereby decreasing development time and cost.
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