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The investigation of modified Norris-Landzberg acceleration models for reliability assessment of Ball Grid Array packages

机译:用于球栅阵列封装可靠性评估的改进Norris-Landzberg加速度模型的研究

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Norris-Landzberg acceleration model, only applying the conditions of the temperature cycling tests such as temperature range, maximum of temperature and cycle times, has been widely using to predict the lifetimes of electronic packages since 1969, due to its simplicity not considering complex damage information such as stress-strain relationships. During the last few years, a number of researches have shown that the N-L model exponents are not constant depending on the type of packages and solder materials (ex. the transition from SnPb solders to lead free solders like SnAgCu alloy) resulting in the variation of acceleration factors. It will increase the average errors of prediction if the original model is continually using without any modification especially for Ball Grid Array (BGA) packages since they are nowadays in the majority in this industry with many types for different applications, moreover, commonly stress-sensitive. The lifetime data of several BGAs presented in this study show that these exponents and acceleration factors depends on the different solder materials, solder pastes, design parameters (die size, package size, ball pitch, and ball size), and even prebaking conditions. Therefore, the modification of N-L model is necessary for the BGAs in order to precisely predict their lifetimes in the field level. According to our survey, not many modified N-L models are presented for all packages. In this paper, two modified N-L models developed by Salmela and Dauksher were introduced respectively since they are likely to easy use. Compared to the original model developed by Norris and Landzberg, Salmela demonstrated that his stress-dependent model is able to reduce the average errors of prediction from 52.4% to 17.8% using the data with respect to different package types and solder materials. Our data were applied to validate Salmela's model, and the results show that the average errors of prediction decrease from 41% to 32%. In case of Dauksher's mode--l, the average errors of prediction also decrease from 41% to 36%. As the results, our data have demonstrated that these two models are capable of providing the better accuracy in predicting the lifetimes of BGAs compared to the original N-L model, though they have improved yet the average errors so much. Furthermore, the Norris-Landzberg-based acceleration models may keep its validity on the reliability assessment of Ball Grid Array packages.
机译:Norris-Landzberg加速度模型仅应用温度循环测试的条件,例如温度范围,最大温度和循环时间,自1969年以来已被广泛用于预测电子封装的寿命,因为其简单性没有考虑复杂的损坏信息例如应力-应变关系。在过去的几年中,许多研究表明,NL模型的指数不是恒定的,具体取决于封装和焊料材料的类型(例如,从SnPb焊料向SnAgCu合金之类的无铅焊料的过渡)导致加速因素。如果原始模型在没有任何修改的情况下连续使用原始模型,将会增加平均预测误差,因为对于当今的球栅阵列(BGA)封装来说,它们是当今大多数,针对不同应用的类型很多,而且通常对应力敏感。这项研究中提供的几种BGA的寿命数据表明,这些指数和加速因子取决于不同的焊锡材料,焊膏,设计参数(芯片尺寸,封装尺寸,焊球间距和焊球尺寸),甚至预烘烤条件。因此,对于BGA,必须修改N-L模型,以便精确预测其在现场水平的寿命。根据我们的调查,没有为所有包装提供很多修改后的N-L模型。本文分别介绍了Salmela和Dauksher开发的两个改进的N-L模型,因为它们很容易使用。与Norris和Landzberg开发的原始模型相比,Salmela证明了他的应力依赖性模型能够使用关于不同封装类型和焊锡材料的数据将预测的平均误差从52.4%降低到17.8%。我们的数据用于验证Salmela模型,结果表明预测的平均误差从41%降低到32%。如果是Dauksher的模式, -- 如图1所示,预测的平均误差也从41%降低到36%。结果,我们的数据表明,与原始的N-L模型相比,这两个模型在预测BGA的寿命方面能够提供更好的准确性,尽管它们已经大大改善了平均误差。此外,基于Norris-Landzberg的加速度模型可以在球栅阵列封装的可靠性评估中保持其有效性。

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