Transparent encapsulating resin for automotive applications

摘要

In this paper, a transparent encapsulating technology for automotive optical semiconductor devices is presented in terms of keeping higher reliability requirement for this market. This is transparent epoxy based encapsulation material that is using thermo set curing system. In compared with standard consumer application, automotive applications include those requiring materials with a high degree of purity, strong surface adhesion, or transparent fillers that are required to handle extremes of heat and humidity condition. LEDs have been used for many years in the displays of car audio systems and instrument panels. In addition to using LEDs for stoplights, future applications include various automotive optical sensors.